COMSOL: cpu cooling with heat sink
Project description
In my optimization class, I decided to model the cooling of my ultrabook's CPU chip using a heat sink component provided by COMSOL's application gallery. I understand that engineers are constantly redesigning internal laptop components for an overall thinner and lighter design; however, thermal limitations are a huge determining factor.
I wanted to see if I could optimize the shape of the heat sink's fins to not only decrease the mass but also to maintain acceptable operating temperatures.
Solution
The optimization method used for this study is Bound Optimization by Quadratic Approximation
(BOBYQA), and its purpose is to make second order gradient approximations to find an optimal
solution. For each dependent variable provided, COMSOL will iterate through a desired range to
minimize the objective function which in this case is the mass of the fins.
results
COMSOL finds that altering the geometry so that the base length is shorter than the top length of the fins is the most optimal way to remove mass. The maximum surface temperature at the interface between the heat sink and CPU chip is 372.87[K] which, although hot, still falls within the allowable operating temperature range ([30C, 100C].